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Press Releases
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Contact:
Dave Quane,
inTEST Corporation |
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inTEST Delivers 750th FLEX System Family Probing Interface
CHERRY HILL, NJ, February 15, 2008 – inTEST Corporation (Nasdaq: INTT), a world leader in developing and manufacturing equipment that reduces the cost of semiconductor testing, announced the shipment of its 750th FLEX™ system family probe interface tower to Teradyne.
The Teradyne FLEX family probe towers are manufactured by inTEST Silicon Valley, the company’s test interface division, and are a key element in the testing of ICs at the wafer level. Designed for use with the Teradyne(R) FLEX family of semiconductor ATE (microFLEX™, FLEX, UltraFLEX™) and Tiger test system, the interface’s high density and modular design allows it to be economically configured for each test application. Pin modules can be added at any time to increase the pin count, allowing true multi-site testing of even the most complex SOC and System in Package (SiP) devices, such as processors with embedded memory, power management devices, microcontrollers and automotive ICs.
Dale Christman, V.P. and General Manager of inTEST Silicon Valley was pleased with his group’s ability to meet the challenging volume shipment demands. “We developed the “Tower in an Hour” program which allowed us to configure and ship any FLEX probing interface within 24-48 hours. This program reflects our commitment to quick-turn manufacturing, and the dedication of our manufacturing group.”
John Adams, General Manager for Teradyne’s Test Cell Business Group, is equally appreciative of inTEST’s performance. “inTEST continues to consistently support Teradyne’s performance, reliability, and responsiveness as a key supplier of test cell interface components. We value the strong partnership between inTEST and Teradyne, and believe it is a key enabler to providing world class test cell solutions to our customers.”
The wafer probing interfaces are a part of inTEST’s Manipulator, Docking and Interface (MDI) technology group, which provides semiconductor manufacturers and IC foundries worldwide with products that greatly improve the utility and efficiency of the IC test process. inTEST designs and manufactures these MDI products in several ISO 9001 certified locations.
About Teradyne, Inc.
Teradyne (NYSE:TER) is a leading supplier of Automatic Test Equipment used to test complex electronics for the consumer electronics, automotive, computing, telecommunications, and aerospace and defense industries. In 2007, Teradyne had sales of $1.1 billion, and currently employs about 3,800 people worldwide. For more information, visit www.teradyne.com. Teradyne (R) is a registered trademark of Teradyne, Inc. in the U.S. and other countries. All product names are trademarks of Teradyne, Inc. (including its subsidiaries).
About inTEST® Corporation
inTEST Corporation is an independent designer, manufacturer and marketer
of ATE interface solutions and temperature management products, which
are used by semiconductor manufacturers to perform final testing of integrated
circuits (ICs) and wafers. The Company’s high-performance products
are designed to enable semiconductor manufacturers to improve the speed,
reliability, efficiency and profitability of IC test processes. Specific
products include positioner and docking hardware products, temperature
management systems and customized interface solutions. The Company has
established strong relationships with semiconductor manufacturers globally,
which it supports through a network of local offices. For more information
visit www.intest.com.
inTEST, Centaur, Centaur Universal SOC Interface,
and Transpar are trademarks of inTEST Corporation
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inTEST Corporation 7 Esterbrook Lane Cherry Hill, NJ 08003
856-424-6886
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