Semiconductor Test Solutions
Since 1971, our products have been at the forefront of providing thermal test solutions for the Semiconductor industry. Whether the requirement is to test wafers or packaged parts, inTEST Thermal Solutions has long been the industry standard.
Wafer Testing
Perform wafer probing, testing and failure analysis from -65° to +300°C. Test wafers up to 300mm diameter at precise temperature at the wafer probing station.
• -65°C to 300°C
• 150mm, 200mm & 300mm
Click Here to learn more about THERMOCHUCK® Temperature Systems.
Packaged Parts Testing
Our THERMOSTREAM® Temperature Forcing Systems are designed for Temperature Testing, Thermal Cycling, Characterization, and Thermal Profiling at the tester site or at your application.
• -90°C to 225°C • Up to 18scfm • 6 models available
Ideal for testing:
• Components, ICs, high speed or other high power devices
• Hybrid Circuits
• Modules or MCMs
• Printed circuit boards and other assemblies
Click Here to learn more about THERMOSTREAM® Temperature Forcing Systems. |